Abstract: diamond cutting blade, with super thin cutting width, cutting surface smooth, low rejection rate, cutting efficiency higher merit, has gradually attracted people's attention. The article reviews the past 10 years of ultrathin diamond cutting slice of the main production method research progress and application status of ultrathin diamond cutting slice, introduces the preparation methods, including electroplating and curing resin method, in which the electroplating method for its simple equipment, green environmental protection, recycling production has become the most possible large-scale industrial application the preparation method, the paper finally points out its development direction.
Key words: thin; diamond cutting tablets; electroplating; curing resin
CLC: TQ164 document code: A article number: 1673-1433 ( 2010) 06-0034-04
Solar energy as an inexhaustible clean energy, its development and utilization are caused by human 's attention, commercial use of solar energy has become the world trend. The solar cell is the birth of solar energy use tools. Silicon solar cell comprises: monocrystalline silicon, polycrystalline silicon thin film solar cell and battery, wherein the monocrystalline silicon energy conversion efficiency of the battery, a photoelectric conversion rate can reach 23%, in the present stage of large-scale application and industrial production to occupy the leading position. In recent years, along with the semiconductor manufacturing technologies continue to mature and perfect, wafer fabrication costs continue to reduce, but by the solar cell of silicon wafer for cutting costs has been high, to account for the solar total manufacturing cost more than 30%. In order to reduce wafer processing occurs during edge collapse possibility, improve material utilization rate, wafer slicing tend to use a thin blade. Currently used common blade can be roughly divided into the thickness of 15 ~ 100 m plating blade and 100 ~ 500 m resin blade two. In our country, the current production of electroplated diamond cutting slice technology is not mature, still basically is in the stage of experimental study, needed for the production of thin film cutting the main dependence from the USA, Germany and Japan import, therefore, high precision diamond cutting tool technology development is China's tools and microelectronic industry urgently needs to solve the problem.
2 diamond cutting slice of
The 2.1 curable resin method
Method for manufacturing diamond cutting slice is a can get very good shape retention method, generally using a thermosetting phenolic resin as binder, it is the practice of diamond abrasive grains are mixed with a resin, and then use the method of hot pressing sintering and hot cured after grinding, this process takes a few hours, so the production cost is high. As technology advances, a heat curable resin was gradually replaced by light cured resin, light curing resin is mainly composed of a base polymer ( photo crosslinked polymer ), a reactive diluent ( a photopolymerizable monomer ), light initiating agent and additive composition. It and heat solidified resin the most substaintial distinction depends on its curing process is to absorb light of appropriate wavelength caused by the chemical reaction process, it changes from liquid to solid is the molecular weight increase results, rather than the solvent evaporation caused by, it has fast curing, no pollution, saving energy, but constraints is the higher prices of raw materials.
Application of light curing resin method for manufacturing ultrathin diamond cutting slice, Peng Wei, Gu Taihong, using light curing resin as a bonding material developed for 0.15mm thickness of ultrathin diamond cutting wheel, and completed on silicon wafer cutting test. Cutting grinding wheel morphology after use for: 53mm * 40MM * 0.15mm. The experiment makes sample cutting test. Through the analysis of the experiment data, the final result is displayed, adding an appropriate amount of SiO2 can improve the cutting performance, and when the added particle content is 48%, the best cutting sheet cutting, cutting a smooth fracture.